Hosei International Fund International Fellowship 2017

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Applications are invited from world-wide scholars for the HIF Fellowship. This fellowship is aimed to support 6 to 12 months research program at Hosei University under the direction of and/or in cooperation with Hosei faculty and researchers. Each of the successful fellows will receive ¥300,000 monthly.

Fellowship Description
In 1980, Hosei University in anticipation of the 100th anniversary of its founding, established the Hosei International Fund (HIF) to advance international cooperation in academic research and scholarship. As one undertaking covered by this fund, academics may apply to the HIF Fellowship Program, also known as the Foreign Scholars Fellowship Program. Invitations are extended to young scholars from abroad who are, at the least, enrolled in a doctoral degree program to apply to the HIF Fellowship Program to carry out non-degree research programs at Hosei University under the direction of and/or in cooperation with Hosei faculty and researchers. It is expected that joint cooperation and coordination with Hosei faculty will contribute much to the development of the university’s research capabilities.

Award Value
Each of the selected applicants will be granted ¥300,000 each month. Housing and travel cost are also covered.

Level and Area of Studies
Research program in the field of humanities, social or natural sciences, or engineering as deemed acceptable by Hosei.

Place of Study
The research can be taken in Japan

Eligibility and Criteria
To be eligible, you must meet all of the criteria as follow:

  • be foreign national
  • be presently enrolled in a doctoral degree program, hold a Doctorate, or its equivalent
  • have sufficient fluency in either Japanese or English
  • be no more than 39 years of age as of April 1, 2018
  • not have been a previous recipient of this fellowship

Applicants’ Nationality
All nationalities except Japan are eligible.

Application Instruction
To apply, all candidates are advised to click the application link below and further instruction.

Submission Deadline
June 2, 2017.

Website and Application Link

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